Visibl selected for the IEEE Hard Tech Venture Summit

Visibl Semiconductors (YC W26) was selected to participate in the IEEE Hard Tech Venture Summit, held April 16–17, 2026, at SRI in Menlo Park, California.

The summit brought early-stage hardware founders together with investors and industry participants. For Visibl, it was an opportunity to meet teams developing new semiconductor approaches across RF, AI chips, and custom silicon for the edge, and to exchange perspectives with people building and supporting hardware companies.

A moment of momentum for hardware

Bilal Zuberi’s keynote emphasized the opportunity facing hardware builders today. That message resonated with what we saw at the summit: teams working on difficult engineering problems, with ambitions that depend on advances in physical technology.

At Visibl, we’re working to make custom silicon accessible to hardware companies. Meeting other founders and operators helped put that work in the context of a broader community developing new devices, systems, and manufacturing approaches.

Connecting with the hard tech community

We’re grateful for the conversations and the chance to meet or reconnect with people across the community, including:

• Timo Korpela — Haltian
• Shoichi Osawa — Sony Semicon (EU)
• Matthew G. Anderson — Oso Semiconductor
• Mike Riccio — NASA
• Pae Wu — SOSV
• Sabrina Sasaki — Monozukuri Ventures
• Daniel Russell — Althing Ventures
• Austin Hickman — Soctera
• Jordan Stowe — CSC Leasing
• Vincent Loncke — Kenyi Technologies

Thank you to IEEE and SRI for bringing these teams together, and to everyone who shared their time and experience with us.